Your Next Innovative Design Starts Here
Join us on Thursday, April 10th, for our in-person seminar to show how Keysight’s EDA software advances new ways to support you in critical high-speed digital and RF and microwave circuit design challenges.
RF and Microwave Circuit Design:
Next-generation wireless communication systems will feature significantly more functionality while operating at higher frequencies in the sub-THz bands. Meeting these demands requires the integration of radio-frequency integrated circuits (RFIC), monolithic microwave integrated circuits (MMIC), laminate or interposer packaging, antennas, and printed circuit boards (PCBs). Learn how assembly, circuit simulation, electromagnetic simulation, and workflow automation advances enable engineers to quickly model and troubleshoot even the most complex multi-technology designs while incorporating AI and machine learning (AI / ML) into the design workflow.
To help you, our seminar topics will include:
High-Speed Digital Design:
Rapid advancements in artificial intelligence and the growing data demands in data centers are driving the need for greater systems integration through advanced packaging technologies, including chiplets (multi-die systems in a package) and faster speed I/O interfaces. As these technologies evolve, signal and power integrity become increasingly complex, presenting significant technical challenges. Stay ahead by hearing from industry experts and peers about best practices and essential strategies to optimize your high-speed digital design workflows.
To help you, our seminar topics will include:
Don’t miss this opportunity to gain insights on the latest high-speed digital and RF advances from our experts.
Check out the detailed agenda below and register to secure your seat today!
