High-performance computing for embedded system applications is pushing the envelope for speed, a small form-factor, and the right price-point. Designers need to carefully balance material selection and PCB fabrication options, together with smart design strategies for vias, connectors, and PCB trace routing. In this webinar, we will walk through the simulation process that SECO Italy has undertaken to ensure design success.
Key Learnings:
- The benefits of using Standard-Specific PCIe Gen5 Tx and Rx AMI models
- An optimization strategy for differential-vias
- An example of Electromagnetic (EM) simulation of modular PCBs with comparison to prototypes
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