Keysight is excited to announce the next destination of our EDA Connect World Tour: Santa Clara, California!
| March 12, 2025 - HSD Day Rapid advancements in artificial intelligence and the growing data demands in data centers are driving the need for greater integration of systems through advanced packaging technologies, including Chiplets (multi-die systems in a package) and faster speed I/O interfaces. As these technologies evolve, signal integrity and power integrity are becoming increasingly complex, presenting significant technical challenges. Stay ahead in the race by hearing from industry experts and peers about best practices and essential strategies to optimize your high-speed digital design workflows. | |
| 10:10 | Power Integrity Master Class on Ground Bounce and EMI Discover cutting-edge techniques for power integrity simulations using digital twins, addressing challenges in data centers, AI, and custom ASICs. Learn how dynamic PI EM models simulate power rail ripple, ground bounce, and EMI crosstalk, ensuring reliable performance under extreme currents and sub-1V power rails. |
| 10:50 | Crosstalk Analysis and Mitigation for 16 Gb/s UCIe Chiplet Interfaces using Keysight Chiplet PHY Designer Explore solutions for managing signal integrity challenges in high-speed UCIe interconnects for chiplet designs in data centers and aerospace. Learn how Keysight ADS Chiplet PHY Designer identifies and mitigates crosstalk, enhances signal integrity, and ensures reliable performance for advanced multi-die packaging at 16 Gb/s and beyond. |
| 11:30 | Enhancing Photonic Design Accuracy with Hybrid Twins: Bridging Physics-Based Simulation and Measurement Discover how hybrid twins are revolutionizing photonic integrated circuit (PIC) design. This session explores combining physics-based simulation with measurement data to bridge the gap between simulation and real-world performance, enabling greater accuracy, reduced design cycles, and faster time-to-market for applications in telecommunications, healthcare, and computing. |
| 12:10 | Lunch Break |
| 12:30 | Accelerating EDA Innovation: HPC Cloud Driven Solutions to Slash Simulation Time Discover how HPC and cloud computing are transforming EDA. Learn how Keysight’s cloud-integrated Software Accelerators cut simulation times by 80%, boost scalability, and streamline workflows to tackle complex semiconductor challenges with unmatched efficiency. |
| 1:10 | LPDDR5X SI/PI simulation and evaluation challenge |
| 1:50 | Conquer the mobile challenge with MIPI C-PHY analysis Explore how advanced SI/PI timing analysis accelerates DDR interface design for high-performance systems. Learn how Socionext, in collaboration with Keysight, developed a unique DDR SI/PI/Timing Verification Environment to analyze LPDDR5X-8533 Mbps interfaces with speed and precision, ensuring faster time-to-market for large-scale computing systems. |
| 2:30 | From Fixing Today’s PCIe Channels to Preparing for Tomorrow’s Designs Master PCIe design with practical solutions for evolving standards. This session explores end-to-end channel modeling, from resolving signal integrity issues in PCIe Gen 3 designs to preparing for PCIe Gen 6. Gain insights on IBIS model analysis, equalization, and compliance checks, helping you reduce re-spins and ensure scalability for next-gen PCIe designs. |
| March 13, 2025 - RF Day Next generation wireless communication systems will feature significantly more functionality while operating at higher frequencies into the sub-THz bands. Meeting these demands requires integration of radio-frequency integrated circuits (RFIC), monolithic microwave integrated circuits (MMIC), laminate or interposer packaging, antennas, and printed circuit boards (PCBs). Learn how advances in assembly, electromagnetic simulation, and automation are enabling engineers to quickly model and troubleshoot even the most complex multi-technology designs while incorporating information and AI techniques into the design process. | |
| 9:30 | Doors Open |
| 10:00 | Welcome/Keynote |
| 10:10 | Keysight EDA new RF/MW design capabilities for AI/ML, 5G/6G & 3DHI (Overview Session) Keysight EDA is revolutionizing RF/MW design with advanced solutions for AI/ML, 5G/6G non-terrestrial networks, and EV applications. Discover how new capabilities like 3DHI RF module integration, Python API automation, and multi-domain simulation streamline complex hardware design, ensuring higher accuracy and efficiency in next-generation wireless systems |
| 11:00 | Enabling Next Generation EM simulation with ADS RFPro 2025 As RF and microwave designs push for higher frequencies, greater functionality, and smaller sizes, integrating complex modules becomes increasingly challenging. This session explores how Keysight ADS, with new RFPro 3DEM simulation and Smart Mount assembly, streamlines heterogeneous integration for 5G, 6G, automotive radar, and wireless networking, enabling faster, more accurate EM analysis and first-pass design success. |
| 11:45 | Re-imagining RF Design Using ADS Python APIs and AI/ML Discover how AI and Machine Learning are transforming RF design with Keysight EDA’s Python APIs. This session explores how automation accelerates measurements, design, and enterprise workflows, driving greater productivity and faster time to market. Hear real-world success stories from industry leaders and unlock new possibilities for your engineering processes. |
| 12:30 | Lunch - Transforming Chaos Into Clarity With Keysight Design Data and IP Management Simplify and enhance your design workflow with a unified data and IP management system. With Keysight's Engineering Lifecycle Management (ELM), have all your design data organized and accessible, empowering innovative designs from initial requirements to final tapeout. Streamline your entire design process and boost knowledge sharing with ELM as your single source of truth. |
| 1:15 | AI/ML-Driven Innovations in 3GPP Standards Explore the rapid evolution of wireless communication technologies, driven by advancements in 3GPP standards and the integration of AI and ML. This seminar will highlight AI/ML-driven air-interface design and its impact on network performance, efficiency, and adaptability. We will also examine the latest 3GPP releases and their implications for future wireless networks. |
| 2:00 | From 5G to 6G: Technology Evolution, Opportunities and Challenges in System Design and Modeling Wireless communication system design engineers are facing a new set of opportunities and challenges with the introduction of 6G standards. Learn more about these technology trends and how realistic modeling and simulation of RF and antenna systems can help the development of 6G solutions. |
